HS Code for Power Semiconductor Modules
The HS Code for power semiconductor modules is 854150. The MFN duty rate for importing to the US is Free.
| HS Code (6-digit) | 854150 |
|---|---|
| US Duty Rate (MFN) | Free |
| EU Duty Rate (MFN) | 0% |
| Chapter | 85 |
| Heading | 8541 |
| Last Updated | 2026-05 |
Description
Other semiconductor devices
HS Code 854150 covers power semiconductor modules with a US MFN duty rate of Free.
Frequently Asked Questions
How does the base semiconductor material (e.g., Silicon vs. Silicon Carbide) affect the classification of power semiconductor modules under HTS 8541.50?
The classification under HTS 8541.50 as 'Other semiconductor devices' does not change based on the base semiconductor material (Si, SiC, GaN). However, the material critically determines the module's electrical properties and performance, which directly influences its valuation and applicable duty rates. For accurate assessment, always declare the specific material composition and technical specifications on shipping documents.
What are the specific customs inspection risks for importing Power Semiconductor Modules under HTS 8541.50?
This classification for 'other semiconductor devices' is frequently targeted for customs verification of country of origin and valuation. Inspectors may demand detailed technical documentation to confirm the modules are not power diodes, thyristors, or transistors classified under more specific subheadings like 8541.30 or 8541.40. Incorrectly declaring the specific semiconductor technology can lead to classification disputes, delays, and potential penalties.
What are the typical additional costs, beyond the product price, when importing power semiconductor modules under HTS 854150?
Importers of power semiconductor modules under HTS 854150 typically pay a 2.6% Most-Favored-Nation (MFN) duty rate. Additional costs include Merchandise Processing Fees (MPF) of 0.3464% (minimum $29.67, maximum $649.56) and a Harbor Maintenance Fee (HMF) of 0.125% if arriving by vessel. An anti-dumping/countervailing duty (AD/CVD) investigation is possible, as similar semiconductor devices have faced such cases, which can impose significant retroactive fees.
Material Variants & Classification Impact
Power semiconductor modules in HTS 8541.50 are classified based on the semiconductor material used in the core devices. Modules containing silicon (Si) devices, the most common type, are correctly placed here. However, modules constructed with newer wide-bandgap semiconductors, such as Silicon Carbide (SiC) or Gallium Nitride (GaN), are also classified under this same heading (8541.50). The classification is not altered by the material of the housing or baseplate (e.g., copper, aluminum, ceramic), as the defining characteristic is the semiconductor's function. Therefore, all power modules, regardless of advanced material technology, fall under 8541.50 if they perform the same electronic switching or amplification function.
Alternative Classifications for Power Semiconductor Modules
Power semiconductor modules are sometimes confused with discrete semiconductors in heading 8541.10 or with simpler devices like thyristors and triacs in heading 8541.30. The key distinction for heading 8541.50 is that it covers modules where multiple semiconductor dice are assembled into a single functional unit, often with a base plate and terminals for power control. For example, a complete insulated-gate bipolar transistor (IGBT) module belongs here, not its individual components. Always verify the device's construction: if it's a single, unencapsulated die (e.g., a bare IGBT chip), it may fall under 8541.90.
Related HS Codes
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